Authors

Department of Mechatronics, Gwangju Institute of Science and Technology, 1 Oryong-dong Buk-gu, Gwangju 500-712, Republic of South Korea

Brian K. Paul

Oregon State University, Industrial and Manufacturing Engineering, 188 Covell Hall, Corvallis, OR 97331-2407, USA

Chandana Karnati

Chemistry and Institute for Micromanufacturing, Louisiana Tech University, Ruston, LA 71272, USA

Daniela S. Mainardi

Institute for Micromanufacturing, Louisiana Tech University Ruston, 71272, USA

Dae Sung Yoon

Microsystem Research Center, Korean Institute of Science and Technology, Seoul 136-791, Republic of South Korea

Edgar Alvarez-Zauco

Centro de Ciencias Aplicadas y Desarrollo Tecnológico, Universidad

Nacional Autónoma de México (UNAM), Circuito Exterior C.U., 04510, Mexico

Elena V. Basiuk

Centro de Ciencias Aplicadas y Desarrollo Tecnológico, UNAM, Circuito Exterior C.U., 04510, Mexico

Giulio Manzoni

Microspace, Via Filzi 6, 34100 Trieste, Italy

Hai-Feng Ji

Chemistry and Institute for Micromanufacturing, Louisiana Tech University, Ruston, LA 71272, USA

Jeong Hoon Lee

Microsystem Research Center, Korean Institute of Science and Technology, Seoul 136-791, Republic of South Korea

John A. Polo

Department of Physics and Technology, Edinboro University of PA, 235 Scotland Road, Edinboro, PA 16444, PA, USA

Jon A Preece

School of Chemistry, University of Birmingham, Edgbaston, Birmingham, B15 2TT, U.K.

Department of Electrical and Computer Engineering

National University of Singapore, 4 Engineering Drive 3, 117576, Singapore M. M. Alkaisi

The MacDiarmid Institute of Advanced Materials and Nanotechnology, Department of Electrical and Computer Engineering, University of Canterbury, Christchurch, New Zealand

Department of Mechatronics, Gwangju Institute of Science and Technology 1 Oryong-dong Buk-gu, Gwangju 500-712, Republic of South Korea

Paula M Mendes

School of Chemistry, University of Birmingham, Edgbaston, Birmingham B15 2TT, U.K.

Qianwang Chen

Hefei National Laboratory for Physical Sciences at Microscale, University of Science and Technology of China, Hefei 230026, Peoples Republic of China

The MacDiarmid Institute of Advanced Materials and Nanotechnology, Department of Electrical and Computer Engineering, University of Canterbury, Christchurch, New Zealand

Robert A. Lee

CSIRO Manufacturing and Infrastructure Technology, Normanby Road, Clayton, Victoria 3168, Australia

S. Kumar Bag

Department of Electronics and Communication Engineering, Vellore Institute of Technology (Deemed University), Vellore, India

Department of Electrical and Computer Engineering, National University of Singapore, 4 Engineering Drive 3, 117576, Singapore

Sungho Jeong

Department of Mechatronics, Gwangju Institute of Science and Technology 1 Oryong-dong Buk-gu, Gwangju 500-712, Republic of South Korea

Sunil Jha

Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Pin: 208016, India

Sunny E. Iyuke

School of Process and Materials Engineering, Faculty of Engineering and the Built Environment, University of the Witwatersrand, Private Bag 3, Wits 2050, Johannesburg, South Africa

Tae Song Kim

Microsystem Research Center, Korean Institute of Science and Technology, Seoul 136-791, Republic of South Korea

Department of Mechanical Engineering, Indian Institute of Technology Kanpur - 208016, India

Vladimir A. Basiuk

Instituto de Ciencias Nucleares, Universidad Nacional Autónoma de México (UNAM), Circuito Exterior C.U., 04510, Mexico

Zhao Huang

Hefei National Laboratory for Physical Sciences at Microscale, University of Science & Technology of China, Hefei 230026, Peoples Republic of China

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