Conclusions

The electrodeposition of Ni on semiconductive Ti02-X layers is used succesfully in LIGA technology. In this process different Ni structures of high aspect ratio in the micron range are obtained. However, the adhesion, nucleation, and growth processes of Ni are yet well understood. The aim of this paper has been to present initial results. A combination of ARXPS measurements, which gave integral stoichiometric information, with local, ex-situ and in-situ STM imaging and DTS analysis has been carrried out for the frst time in the nanometer range. Ni-TiCh-x interface compounds, Ni nucleation and growth have given a new insight into the crucial processes defining the quality of Ni-LIGA structures.

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