STM Study of Electrodeposition of Strained Layer Metallic Superlattices

T. P. Moffat Contents

Summary. An STM study has been initiated to investigate the various processes associated with electrodeposition of Cu-Ni multilayers on Cu(100). The substrates were prepared by electropolishing in phosphoric acid followed by immersion in 10 mmol/1 HC1. A (V2 x a/2)R45° adlattice of oxidatively adsorbed chlorine is formed under these conditions. The adlayer stabilizes the surface steps in the <100> direction which corresponds to the close packed direction of the chloride adlattice. In dilute (millimolar) solutions of cuprous ion, reduction occurs under mass transport control with the electrocrystallization reaction proceeding by step flow in the <100> direction. At more negative potentials chloride is partially desorbed. Coincidentally, the highly kinked metal steps become frizzy and move towards adopting the close-packed <110> orientation of the metal lattice. Preliminary experiments on heteroepitaxial nickel deposition reveal regions where electrocrystallization on Cu(100) occurs via step flow in the <110> direction.

3.4 Heteroepitaxial Deposition on Cu( 100)

4 Conclusions

5 References

1 Introduction

2 Experimental details

3 Results and discussion

3.1 Substrate preparation and structural characterization

3.2 Reductive desorption of chloride adlattice

3.3 In-situ observation of growth dynamics on Cu(100)

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